Achieve fast and reliable surface activation for PDMS/glass and PDMS/PDMS bonding with this plug & play handheld plasma tool. Ideal for microfluidics and soft lithography applications, it delivers atmospheric plasma in a safe, ergonomic format.
General
The Plasma Bonding Pen is a compact surface treatment device designed for cleanroom or laboratory use. It enables precise and consistent plasma activation of PDMS, glass, and other non-conductive materials prior to bonding.
The device is particularly well-suited for PDMS chip assembly, supporting bonding pressures up to 2 bar. Features include customizable treatment power and duration, a user-friendly menu, and a replaceable standard module optimized for dielectric substrates.
This system is ideal for microfabrication and prototyping workflows where plasma surface modification is required.
Content
1x Plasma Bonding Pen
1x Standard plasma module (installed)
1x Plug-in power supply
1x Storage/transport case with foam insert
Specifications
| Weight |
110 g |
| Length |
215 mm |
| Diameter |
27 to 38 mm |
| Power Supply |
110 V or 230 V; 50/60 Hz |
| Power Consumption |
18 W |
| Plasma Temperature |
< 50°C |
| Treatment Distance |
2 to 10 mm |
| Treatment Area |
5×5 mm² to 20×20 mm² |
| Recommended Use |
PDMS/Glass or PDMS/PDMS bonding |
| Control Interface |
Display + button-operated menu |
| Housing Protection |
IP20 |
| Compliance |
CE, FCC, RoHS |
Documentation
User Guide – Plasma Bonding Pen
Performing PDMS bonding with the Plasma Bonding Pen
1. Clean both bonding surfaces using Isopropanol or your standard cleaning process.
2. Ensure proper adjustment of the three main parameters:
- Distance: Maintain approximately 5 mm / 0.2" between the nozzle and the surface.
- Power: Set plasma power to 100% via the “Power” menu.
- Time: Treat each surface for 30 seconds to 1 minute. Use the “Timing” menu in Countdown or Metronome mode to monitor this.
3. Treat both surfaces completely and press them together shortly after activation. Plasma activation is temporary.
4. For optimal bonding, perform thermal annealing for 5–10 minutes at around 80 °C.
After bonding, your PDMS chip is ready to use and can withstand internal pressures up to approximately 2 bars.
