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Accessories and consumables that work with this product
Whereas standard ChipShop connectors only accept soft-walled tubing, this set of connectors allows connecting any 1/16" OD rigid tubing to a ChipShop chip.
Suitable for rigid tubing (PTFE, PEEK, etc.) with an OD of 1/16" (1.6 mm). Manufactured in blue TPE, max. pressure of 3.2 bar with a 1/16" OD PEEK tubing.
Plugs to block unused ports are also available in our shop.
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The plasma module is the exchangeable tip of the STTS Plasma Bonding Pen that generates and shapes the plasma discharge. Modules are installed tool-free by hand onto the pen's module carrier, and the pen automatically detects which module is installed and adjusts its process parameters accordingly.
Since the plasma is generated by discharge of a high electric field, the electrical conductivity of the substrate is the key factor when choosing a module: non-conductive materials such as PDMS and glass require a different module than conductive or partially conductive materials such as metals, CFRP or ITO.
For PDMS/glass and PDMS/PDMS microfluidic chip bonding, the Standard module is the recommended choice.
1x Replacement plasma module (variant as selected)
| Module | Recommended for | Working distance | Activation width | Process gas |
| Standard | Non-conductive substrates (PDMS, glass, plastics, ceramics) | 1–5 mm | ~5–29 mm (air) ~5–50 mm (N2) |
Air or N2 |
| Nearfield | Conductive substrates (metals, CFRP, ITO, conductive polymers) | 0.5–2 mm | ~14 mm | Air |
| Needle | Non-conductive substrates, narrow grooves, bores and cavities | 2–5 mm | ~2–5 mm | Air |
| Nearfield Needle | Conductive substrates, narrow grooves, bores and cavities | 0.5–2 mm | ~2–5 mm | Air |
| Multigas | Inert-gas processes on non-conductive or conductive substrates (Ar/He) | 2–20 mm | ~5–15 mm | N2, Ar or He (0.5–3 l/min) |
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