The POLOS Hotplate 200 Standard and Advanced are precision cleanroom-compatible laboratory hotplates designed for soft bake, hard bake, and curing processes requiring accurate and repeatable temperature control.
General
The POLOS Hotplate 200 series is designed for R&D, Cleanroom, laboratory, and pilot line applications requiring stable and repeatable heating performance. Available in Standard and Advanced versions, the system is suitable for soft bake, hard bake, and curing of photoresist, epoxy, and related materials.
Both models feature a 220 x 220 mm anodized aluminium heating surface suitable for a single 200 mm wafer, with a temperature range of 50 - 230°C and temperature uniformity of ±1°C. Programmable storage for up to 20 temperature/time programs and a countdown timer support repeatable process control.
The Standard model includes a soft-close lid for convenient single-handed operation and glove-friendly use. The Advanced version adds programmable lifting pins, proximity pins, perforated vacuum bake functionality, and an Nitrogen connection for more demanding processing applications.
The Hotplate 200 series is supplied as a tabletop system, while indeck/integrator configurations are available upon request using dedicated mounting brackets and display brackets.
Features & Benefits
- Precise temperature control: Temperature range of 50 - 230°C with ±1°C uniformity for repeatable processing.
- Programmable operation: Stores up to 20 temperature/time programs with integrated countdown timer.
- Soft-close lid: Enables smooth single-handed operation while improving usability in laboratory environments.
- Glove-friendly interface: Designed for convenient operation in cleanroom and process environments.
- Advanced bake capability: Advanced model includes vacuum bake functionality, programmable lifting pins, and proximity pins for controlled wafer handling.
- Nitro connection: Included on the Advanced version for controlled processing environments.
- Flexible installation: Tabletop system with indeck/integrator configuration available upon request.
Applications
The POLOS Hotplate 200 series is suitable for laboratory and semiconductor processing applications requiring stable and repeatable substrate heating.
- Soft bake processes
- Hard bake processes
- Photoresist curing
- Epoxy curing
- Wafer heating and substrate preparation
- R&D and pilot line applications
Content
1x POLOS Hotplate 200, Standard or Advanced version depending on selected model
1x Power Supply
Specifications
| Specification |
Hotplate 200 Standard |
Hotplate 200 Advanced |
| Heater surface area |
220 x 220 mm |
| Suitable wafer size |
1 x 200 mm wafer |
| Temperature range |
50 - 230°C |
| Programmable storage |
20 programs (Temperature / Time) |
| Countdown timer |
1 - 999 sec. |
| Temperature uniformity |
±1°C |
| Voltage |
230 or 110 VAC |
| Heater block material |
Aluminium (anodized) |
| Housing material |
Powder coated steel |
| Weight |
12 kg |
| Dimensions |
Approx. 422 x 295 x 201 mm (without lid) |
| Soft-close lid |
Yes |
Yes, with nitrogen connection |
| Glove-friendly operation |
Yes |
Yes |
| Programmable lifting pins |
No |
Yes |
| Proximity pins |
No |
Yes |
| Perforated vacuum plate / vacuum bake |
No |
Yes |
Documentation
POLOS HOTPLATE200 - Data Sheet
