Wafer Hot Plate - POLOS HOTPLATE 350 Advanced

POLOS

Wafer Hot Plate - POLOS HOTPLATE 350 Advanced

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Support by a team of engineers & PhDs

Support by a team of engineers & PhDs

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General
Content
Specifications
Documentation

Whereas standard ChipShop connectors only accept soft-walled tubing, this set of connectors allows connecting any 1/16" OD rigid tubing to a ChipShop chip.

Suitable for rigid tubing (PTFE, PEEK, etc.) with an OD of 1/16" (1.6 mm). Manufactured in blue TPE, max. pressure of 3.2 bar with a 1/16" OD PEEK tubing.

Plugs to block unused ports are also available in our shop.

Power Supply

3 options for this product

Wafer Hot Plate - POLOS HOTPLATE 350 Advanced

SKU: SP-HP350AD-EU

EU Power Supply

Available immediately

Wafer Hot Plate - POLOS HOTPLATE 350 Advanced

SKU: SP-HP350AD-UK

UK Power Supply

Available immediately

Wafer Hot Plate - POLOS HOTPLATE 350 Advanced

SKU: SP-HP350AD-US

US Power Supply

Available immediately

The POLOS Hotplate 350 Advanced is a precision, cleanroom ready, laboratory hotplate designed for soft bake, hard bake, and curing processes on substrates up to 300 mm.

General

The POLOS Hotplate 350 Advanced is designed for R&D, Cleanroom, laboratory, and pilot line environments requiring accurate and repeatable substrate heating. The system is suitable for soft bake, hard bake, and curing of photoresist, epoxy, and related materials.

The hotplate features a 350 x 350 mm anodized aluminium heating surface suitable for a single 300 mm wafer, with a temperature range of 50 - 230°C and temperature uniformity of ±1°C. Programmable storage for up to 20 temperature/time programs and an integrated countdown timer support repeatable process control.

The system includes programmable electric lifting pins, proximity pins, perforated vacuum bake functionality, glove-friendly operation, and a soft-close lid with integrated N2 connection for demanding process applications.

The Hotplate 350 Advanced is supplied as a tabletop system, while indeck/integrator configurations are available upon request using a dedicated indeck display bracket.

Features & Benefits

Large heating surface: 350 x 350 mm heater area suitable for processing 300 mm wafers.
Precise temperature control: Temperature range of 50 - 230°C with ±1°C uniformity for repeatable heating performance.
Programmable operation: Stores up to 20 temperature/time programs with integrated countdown timer.
Soft-close lid: Enables smooth single-handed operation while improving usability in cleanroom environments.
Glove-friendly interface: Designed for convenient operation in laboratory and semiconductor processing environments.
Advanced bake capability: Includes perforated vacuum plate, programmable lifting pins, and proximity pins for controlled wafer handling and hard contact bake processes.
Nitrogen connection: Integrated nitrogen connection supports controlled process environments.
Flexible installation: Tabletop configuration standard, with indeck/integrator installation available upon request.

Applications

The POLOS Hotplate 350 Advanced is suitable for laboratory and semiconductor processing applications requiring stable and repeatable substrate heating.

Soft bake processes
Hard bake processes
Photoresist curing
Epoxy curing
Wafer heating and substrate preparation
R&D and pilot line applications
300 mm wafer processing

Content

1x POLOS Hotplate 350 Advanced

1x Power Supply

Specifications

Specification	POLOS Hotplate 350 Advanced
Heater surface area	350 x 350 mm
Suitable wafer size	1 x 300 mm wafer
Temperature range	50 - 230°C
Programmable storage	20 programs (Temperature / Time)
Countdown timer	1 - 999 sec.
Temperature uniformity	±1°C
Voltage	230 or 110 VAC
Heater block material	Aluminium (anodized)
Housing material	Powder coated steel
Soft-close lid	Yes, with Nitrogen connection
Glove-friendly operation	Yes
Programmable lifting pins	Yes
Proximity pins	Yes
Perforated vacuum plate / vacuum bake	Yes

Documentation

POLOS HOTPLATE350 Advanced - Data Sheet

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Wafer Hot Plate - POLOS HOTPLATE 350 Advanced

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The POLOS Hotplate 350 Advanced is a precision, cleanroom ready, laboratory hotplate designed for soft bake, hard bake, and curing processes on substrates up to 300 mm.

General

Features & Benefits

Applications

Content

Specifications

Documentation

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